A semiconductor package using a constituent for film adhesive, a manufacturing method for the same, film adhesive, and film adhesive, and a manufacturing method for the same

Title:

A semiconductor package using a constituent for film adhesive, a manufacturing method for the same, film adhesive, and film adhesive, and a manufacturing method for the same

Document Type and Number:

Japanese Patent JP6239500

Kind Code:

B2

Abstract:

A method for producing a composition for film adhesives, said composition having an elastic modulus of 20-3,000 MPa at 200°C after thermal curing and a saturation water absorption of 1.5% by mass or less after thermal curing, and containing (A) an epoxy resin, (B) an epoxy resin curing agent, (C) a phenoxy resin and (D) surface-treated spherical silica fillers which are obtained by surface-treating spherical silica fillers that have an average particle diameter of 0.01-2.0 mum with a silane coupling agent, with the content of the surface-treated spherical silica fillers (D) being 30-70% by mass relative to the total amount of the epoxy resin (A), the epoxy resin curing agent (B), the phenoxy resin (C) and the surface-treated spherical silica fillers (D). This method for producing a composition for film adhesives is characterized by comprising: a step for obtaining a surface-treated spherical silica filler dispersion by dispersing the surface-treated spherical silica fillers (D) in an organic solvent; and a step for obtaining a composition for film adhesives by mixing the epoxy resin (A), the epoxy resin curing agent (B) and the phenoxy resin (C) into the surface-treated spherical silica filler dispersion.

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Inventors:

Minoru Morita
Hiroyuki Yano
Shinji Ohira

Application Number:

JP2014512642A

Publication Date:

November 29, 2017

Filing Date:

April 24, 2013

Export Citation:

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Assignee:

THE FURUKAW ELECTRIC CO.,LTD.

International Classes:

C09J163/00; C09C1/28; C09C3/08; C09J5/00; C09J7/00; C09J11/04; C09J11/06; C09J171/12; H01L21/52

Domestic Patent References:

JP2011080033A
JP2001024005A
JP2003253220A
JP2004146620A
JP2010168470A

Foreign References:

WO2012043764A1

Attorney, Agent or Firm:

Patent Business Corporation St. Crest International Patent Office

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