Title:
センサーデバイス
Document Type and Number:
Japanese Patent JP7173412
Kind Code:
B2
Abstract:
There is provided a sensor device in which flexibility is ensured over the entirety of the device and that can be manufactured at low costs. A sensor device 10 having flexibility includes a flexible substrate 11, a temperature/humidity sensor 21 connected to the flexible substrate 11, and an exterior body 12 formed of a soft material. The temperature/humidity sensor 21 has a waterproof moisture-permeable material 21b that covers a detection surface 21a. The exterior body 12 has an opening 12a that exposes the waterproof moisture-permeable material 21b. The flexible substrate 11 is bonded at at least a peripheral part thereof to the exterior body 12.
Inventors:
Shunji Baba
West history
West history
Application Number:
JP2022531728A
Publication Date:
November 16, 2022
Filing Date:
June 10, 2021
Export Citation:
Assignee:
DIC Corporation
International Classes:
G01D11/30; G01D11/24
Domestic Patent References:
| JP2015187603A | ||||
| JP201611941A |
Foreign References:
| US20140076026 |
Attorney, Agent or Firm:
Takayuki Ohno
Akihiro Iwamoto
Hidefumi Sugaya
Niwa Masahiro
Akihiro Iwamoto
Hidefumi Sugaya
Niwa Masahiro