センサ装置 - MURATA MANUFACTURING CO.,LTD.

Title:

センサ装置

Document Type and Number:

Japanese Patent JP7439920

Kind Code:

B2

Abstract:

A sensor device (1) senses the force caused by contact of an object (5) and the proximity of the object (5). The sensor device (1) comprises a force sensing unit (2), a substrate (10), and one or more sensing electrodes (4). The force sensing unit (2) deforms in response to contact of the object (5) and senses force. The force sensing unit (2) is provided to the substrate (10). The one or more sensing electrodes (4) are configured as an outer cladding on the force sensing unit (2) and/or the substrate (10) and sense the proximity of the object (5) on the basis of changes in capacitance.

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Inventors:

Hiroshi Watanabe
Takatoshi Kato
Yuta Aoki

Application Number:

JP2022528449A

Publication Date:

February 28, 2024

Filing Date:

March 18, 2021

Export Citation:

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Assignee:

MURATA MANUFACTURING CO.,LTD.

International Classes:

G01L1/16; G01L1/00; G01L1/14; G01L1/22

Domestic Patent References:

JP2019039835A
JP2011053212A

Foreign References:

US20170356812
WO2020017177A1
WO2019167744A1

Attorney, Agent or Firm:

Hiroshi Okabe
Hidetaka Okabe
Hiroshi Takeuchi

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