センサ機器 - Mitsubishi Electric Corporation

Title:

センサ機器

Document Type and Number:

Japanese Patent JP7156065

Kind Code:

B2

Abstract:

To reduce cost by downsizing a sensor device.SOLUTION: A sensor device 1 comprises: a substrate on which a sensor is mounted; and a device body 1a to which the substrate is assembled. The device body 1a has: a main body 10 to which the substrate is fitted; and a cover 20 which covers the substrate from above. The main body 10 has: an outer peripheral wall 12 which surrounds the outer periphery of the substrate; and a spring fixing part 11 to which a mounting spring 40 for installing the device body 1a on a ceiling is fitted. The spring fixing part 11 protrudes upward. The cover 20 has an opening which vertically penetrates the cover 20. The substrate has a terminal block 32 mounted thereon which is provided with a terminal electrically connectable to an external device. The terminal block 32 protrudes upward from the opening. An upper end of the terminal block 32 is located below an upper end of the spring fixing part 11.SELECTED DRAWING: Figure 3

Inventors:

Akihiro Omori
Seiji Matsuda

Application Number:

JP2019018937A

Publication Date:

October 19, 2022

Filing Date:

February 05, 2019

Export Citation:

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