Title:
A sheet for heat-resistant attachment
Document Type and Number:
Japanese Patent JP6164468
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat-resistant pasting sheet which can be peeled without a paste residue to an adherend when the pasting sheet is peeled from the adherend even after exposed to a high-temperature environment.SOLUTION: There is provided a pasting sheet obtained by laminating an antistatic easily adhesive layer and an absorption layer in this order on one surface (A surface) of a polyimide film, wherein the antistatic easily adhesive layer contains a polythiophene-based conductive polymer and a dopant, or contains a polythiophene-based conductive polymer, a dopant and a crosslinking agent.
Inventors:
Hiroaki Irie
Kyoichi Suzuki
Kyoichi Suzuki
Application Number:
JP2013101899A
Publication Date:
July 19, 2017
Filing Date:
May 14, 2013
Export Citation:
Assignee:
Fuji Copian Co., Ltd.
International Classes:
C09J7/02; B32B27/00; B32B27/18; B32B27/26; B32B27/34; C09J183/00
Domestic Patent References:
| JP2010083081A | ||||
| JP2008143923A | ||||
| JP2006119348A | ||||
| JP2012207110A | ||||
| JP2012162624A | ||||
| JP2006119355A | ||||
| JP2009009125A | ||||
| JP2009030028A | ||||
| JP2012041505A | ||||
| JP2014213545A | ||||
| JP5331431A |
Foreign References:
| US20090017249 |