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Patent Searching and Data


Title:
シャワーヘッド
Document Type and Number:
Japanese Patent JP5270057
Kind Code:
B2
Abstract:
The disclosure relates to a showerhead for distributing gases in a semiconductor process chamber (100). In one embodiment, a showerhead (118) comprising a perforated center portion (214), a mounting portion (202) circumscribing the perforated center portion and a plurality of bosses (210) extending from the mounting portion each having a hole disposed therethrough is provided. Another embodiment of the invention provides a showerhead that includes a mounting portion (202) having a first side circumscribing a perforated center portion (214). A ring (304) extends from the first side of the mounting portion. A plurality of mounting holes (306) are disposed in the mounting portion radially to either side of the ring. The showerhead provides controlled thermal transfer between the showerhead and chamber lid resulting in less deposition on the showerhead.

Inventors:
Karl Aliitt
Bevan Vo
Salvador Peuma Toy
San Nutrin
Chiang-Te Kao
Ken Counry
Bozen
Pinzian
Sequel
Anzon Zhang
Application Number:
JP2001228708A
Publication Date:
August 21, 2013
Filing Date:
June 22, 2001
Export Citation:
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Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
B05B1/14; H01J37/32; C23C16/455; H01L21/205; C23C16/44
Domestic Patent References:
JP9153481A
JP2001135499A
JP11111626A
JP7273096A
Attorney, Agent or Firm:
Minoru Nakamura
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda