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Patent Searching and Data


Title:
SHRINK FILM PACKAGE WITH MOUNT
Document Type and Number:
Japanese Patent JP2018070257
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a shrink film package with a mount, which is capable of giving high-quality feeling without causing any harm in the shrink.SOLUTION: A shrink film package with a mount includes: a mount body in which a shrink film with which a packed object is packed is attached to a front surface; a base part 30 comprising at least an upper surface plate 31 having an opening 31a into which a lower end of the shrink film is inserted by bending a bending part extending to the lower side of the mount body to be formed in a square cylindrical shape extending in a horizontal direction, a front surface plate covering the front surface at the lower end of the shrink film, a bottom surface plate 33, and a back surface plate 34; and a side wall part 48 at which a circulation hole 50 prescribed to a predetermined opening area is formed by bending a part of the bending part, closing a part of an internal space 35 of the base part on one end side and the other end side in the horizontal direction, and enabling gas circulation into the internal space.SELECTED DRAWING: Figure 7

Inventors:
SAIKAI KEN
SUZUKI SHINGO
YOSHIMOTO YUJI
Application Number:
JP2016216195A
Publication Date:
May 10, 2018
Filing Date:
November 04, 2016
Export Citation:
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Assignee:
LION CORP
FUJI SEAL INC
International Classes:
B65D73/00
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Suzuki Mitsuyoshi
Yuichiro Kawagoe
Hiroyuki Kato