Title:
シリコーンゴム微粒子含有エポキシ樹脂組成物、プリプレグ、金属張積層板、プリント配線板及び半導体装置
Document Type and Number:
Japanese Patent JP5589364
Kind Code:
B2
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Inventors:
Obata 浩
Woods Seiji
Akihiko Tobisawa
Woods Seiji
Akihiko Tobisawa
Application Number:
JP2009265256A
Publication Date:
September 17, 2014
Filing Date:
November 20, 2009
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L63/00; B32B15/08; C08J5/24; C08K3/22; C08K3/36; C08L35/00; C08L79/04; C08L83/04; H01L23/14; H05K1/03
Attorney, Agent or Firm:
Kishimoto Expert
Akihiko Yamashita
Akihiko Yamashita