Title:
The silver flakes adhesives in which sintering for electronic equipment is possible
Document Type and Number:
Japanese Patent JP5972291
Kind Code:
B2
Abstract:
A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition.
Inventors:
Couder, Harry Richard
Sanchez, Juliet Grace
Cao, Shinpei
Grossman, Matthias
Sanchez, Juliet Grace
Cao, Shinpei
Grossman, Matthias
Application Number:
JP2013555416A
Publication Date:
August 17, 2016
Filing Date:
December 16, 2011
Export Citation:
Assignee:
Henkel AG & Co. KGaA
International Classes:
H01B1/22; C09J1/00; C09J9/02; H01B1/00
Domestic Patent References:
| JP2010180471A |
Attorney, Agent or Firm:
Katsuhiro Ito
Akiko Ono
Akiko Ono