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Patent Searching and Data


Title:
現場基板温度モニター法及び装置
Document Type and Number:
Japanese Patent JP2007512711
Kind Code:
A
Abstract:
In a plasma processing system, a method of determining the temperature of a substrate is disclosed. The method includes positioning the substrate on a substrate support structure, wherein the substrate support structure includes a chuck. The method further includes creating a temperature calibration curve for the substrate, the temperature calibration curve being created by measuring at least a first substrate temperature with an electromagnetic measuring device, and measuring a first chuck temperature with a physical measuring device during a first isothermal state. The method also includes employing a measurement from the electromagnetic measurement device and the temperature calibration curve to determine a temperature of the substrate during plasma processing.

Inventors:
Steger, Robert, Jay.
Application Number:
JP2006541310A
Publication Date:
May 17, 2007
Filing Date:
November 15, 2004
Export Citation:
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Assignee:
LAM RESEARCH CORPORATION
International Classes:
H01L21/3065; C23C16/44; G01J5/00; G01K15/00; H01L
Domestic Patent References:
JPH05190462A1993-07-30
JPH02256254A1990-10-17
Attorney, Agent or Firm:
Takenori Hiroe
Takanobu Takekawa
High Shinichi Ara
Nakamura Shigenori
Tsutomu Nishio