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Title:
SLEEVE FOR FORMING SECTION THROUGH-HOLE ON FLOOR OR WALL BODY OF ARCHITECTURAL STRUCTURE
Document Type and Number:
Japanese Patent JP2017227111
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sleeve that has strength against an external impact and adhesion of expansion residue to concrete.SOLUTION: A sleeve 1 for forming a section through-hole on a floor or a wall of an architectural structure comprises: a hollow first sleeve 10, which has a body part 11 and an increased diameter part 16 continuing from the body part 11; and a hollow second sleeve 20, which has a thermal expansion body part 21 capable of engaging with inside of the increased diameter part 16 of the first sleeve 10. The sleeve 1 satisfies any one of following relationships (i) to (iii): (i) an inner diameter of the body part 11 of the first sleeve 10 is smaller than that of the body part 21 of the second sleeve 20; (ii) the inner diameter of the body part 11 of the first sleeve 10 is equal to that of the body part 21 of the second sleeve 20; and (iii) the inner diameter of the body part 11 of the first sleeve 10 is larger than that of the body part 21 of the second sleeve 20, and the difference between the inner diameter of the body part 21 of the second sleeve 20 and that of the body part 11 of the first sleeve 10 is 8% or less of the inner diameter of the body part 11 of the first sleeve 10.SELECTED DRAWING: Figure 4

Inventors:
NAKAJIMA HIDEYASU
SHIMAMOTO TOMOO
ISORI YOICHI
Application Number:
JP2017078936A
Publication Date:
December 28, 2017
Filing Date:
April 12, 2017
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
E04B1/94; F16L5/00
Domestic Patent References:
JP2006274643A2006-10-12
JP2015166605A2015-09-24
JP2011250912A2011-12-15
JP2005194765A2005-07-21
Foreign References:
US20140260015A12014-09-18
Attorney, Agent or Firm:
Patent Business Corporation Saegusa International Patent Office