Title:
A slot processing tool and a slot processing device for substrates of a substrate
Document Type and Number:
Japanese Patent JP6061612
Kind Code:
B2
Abstract:
The invention relates to a groove processing tool for a substrate and a groove processing device for a substrate. The invention aims to enable the swing angle of the groove processing tool to be small and to stabilize the processing quality by well removing cutting scraps when the groove processing tool is processing grooves by shuttling relative to the substrate. The groove processing tool is maintained by a holder 17, and used for forming grooves in the substrate by shuttling on the substrate together with the holder 17 in an opposite manner. The groove processing tool comprises a tool body 36 held by the holder 17, and a knifepoint part 37 formed at a front end of the tool body 36. The knifepoint part 37 comprises a first knife 38a, a second knife 38b and a withdrawing part 39. The first knife 38a is formed at the front end of the tool body 36 and at a front end of a leaving movement side in the movement direction. The second knife 38b is formed at a coming movement side. The withdrawing part 39 is formed between the first knife 38a and the second knife 38b and is recessed toward a side of the tool body 36.
Inventors:
Mitsuru Yamada
Masanobu Soyama
Masanobu Soyama
Application Number:
JP2012235557A
Publication Date:
January 18, 2017
Filing Date:
October 25, 2012
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B26D1/04; B26D3/06; B28D5/00
Domestic Patent References:
| JP2012146954A | ||||
| JP10328922A | ||||
| JP2012119610A |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation
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