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Title:
【発明の名称】誘導結合プラズマ堆積で形成された金属膜の均一性を強化する小直径コイル
Document Type and Number:
Japanese Patent JP2002512310
Kind Code:
A
Abstract:
An apparatus and method for sputtering ionized material onto a workpiece with the aid of a plasma which ionizes the material, utilizing: a support member having a workpiece support area for supporting a workpiece that has a given diameter; a target constituting a source of material to be sputtered; and a coil located between the target and the workpiece support for creating a plasma which ionizes material sputtered from the target, the coil enclosing a region, the support member being maintained at a potential which causes ionized material to be attracted to the support member. The coil is configured and operated to shape the plasma in a manner to promote redirection of material sputtered from the center of the target back to the target.

Inventors:
Gopal Raja, Prabram
Kuh, Tseng
Ruff, Hoffman
Application Number:
JP2000545172A
Publication Date:
April 23, 2002
Filing Date:
April 16, 1999
Export Citation:
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Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H05H1/46; C23C14/34; C23C14/40; H01J37/32; H01J37/34; (IPC1-7): C23C14/34; C23C14/40; H01J37/32; H01J37/34; H05H1/46
Attorney, Agent or Firm:
Yoshiki Hasegawa (1 person outside)