Title:
はんだバンプ形成方法及び装置
Document Type and Number:
Japanese Patent JP4759509
Kind Code:
B2
Abstract:
An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or ref lowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side. With the former feature, oxidization of the solder paste on the substrate where no hot air comes and adhesion of particles to the substrate can be prevented, and with the latter feature, solder particles near the pad electrode are melted earlier and wet and spread over the pad electrode, solder particles above and far from the pad electrode are not melted sufficiently, and an effect of reducing the possibility that solder particles join together can be expected.
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Inventors:
Shirai Dai
Junichi Onozaki
Koji Saito
Isao Sakamoto
Masahiko Furuno
Haruhiko Ando
Atsushi Hiratsuka
Junichi Onozaki
Koji Saito
Isao Sakamoto
Masahiko Furuno
Haruhiko Ando
Atsushi Hiratsuka
Application Number:
JP2006511680A
Publication Date:
August 31, 2011
Filing Date:
March 29, 2005
Export Citation:
Assignee:
TAMURA CORPORATION OF CHINA LIMITED
Japan Science and Technology Agency
Japan Science and Technology Agency
International Classes:
H01L21/60; B23K1/012; B23K3/06; F27B17/00; F27D7/02; H01L21/48; H01L23/12; H05K3/34
Domestic Patent References:
| JP2002261109A | 2002-09-13 | |||
| JPH1168303A | 1999-03-09 | |||
| JPH11251737A | 1999-09-17 | |||
| JP2001068848A | 2001-03-16 |
Attorney, Agent or Firm:
Isamu Takahashi