Title:
A solder paste, electrically conductive adhesive, its manufacturing method, and a manufacturing method of a semiconductor device
Document Type and Number:
Japanese Patent JP6182877
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a solder paste in which a large amount of Zn particles are added to a solder paste containing Sn-Bi-based solder alloy particles without substantially increasing a melting point of the solder alloy, and substantially oxidizing the Zn particles.SOLUTION: A solder paste contains powder of an Sn-Bi-based solder alloy, Zn particles covered with an oxide film of a first metal element excluding Sn and Bi, and a flux. The first metal element has higher affinity with oxygen than with Zn.
Inventors:
Keishiro Okamoto
Kozo Shimizu
Seiki Sakuyama
Kozo Shimizu
Seiki Sakuyama
Application Number:
JP2013013520A
Publication Date:
August 23, 2017
Filing Date:
January 28, 2013
Export Citation:
Assignee:
富士通株式会社
International Classes:
B23K35/22; B22F1/00; B22F1/02; B22F9/08; B23K1/00; B23K35/14; B23K35/26; B23K35/28; C22C12/00; H01L21/60; H05K3/34
Domestic Patent References:
| JP2003290974A | ||||
| JP2011161495A | ||||
| JP2003112285A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Akinori Yamaguchi
Tadahiko Ito
Akinori Yamaguchi