Title:
はんだ印刷機
Document Type and Number:
Japanese Patent JP7410297
Kind Code:
B2
Abstract:
A solder printing machine, which is configured to print paste-state solder on a board by use of a mask and a squeegee configured to move on an upper surface of the mask, includes a bed, a mask frame fixedly provided on the bed and configured to hold the mask, and a squeegee frame fixedly provided on the bed, formed separately from the mask frame, and configured to support a driving mechanism configured to drive the squeegee.
Inventors:
Yoshifumi Fukakusa
Application Number:
JP2022531110A
Publication Date:
January 09, 2024
Filing Date:
June 15, 2020
Export Citation:
Assignee:
Fuji corporation
International Classes:
B41F15/08; H05K3/34
Domestic Patent References:
| JP2012240225A | ||||
| JP2017164948A | ||||
| JP10309794A |
Foreign References:
| WO2017212541A1 | ||||
| CN101791898A |
Attorney, Agent or Firm:
Patent Attorney Corporation Kyoritsu Patent Office