Title:
SOLDER BUMP PRODUCING METHOD, AND DISPERSION PLATING LIQUID
Document Type and Number:
Japanese Patent JP2017188488
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide: a solder bump producing method by which the composition of a solder bump can be controlled with good accuracy in a relatively easy manner; and a dispersion plating liquid used in the solder bump producing method.SOLUTION: A solder bump producing method for forming a solder bump made of a Sn alloy on a surface of a base material comprises: a plating step of forming a Sn-plating body by using a dispersion plating liquid prepared by dispersing core-shell particles 30 in an Sn plating liquid to perform an electrolytic plating, the core-shell particles each have a core part 31 including alloy elements of the Sn alloy and a shell part 32 composed of Sn and covering the core part 31; and a reflow step of melting the Sn-plating body to form the solder bump made of the Sn alloy.SELECTED DRAWING: Figure 3
Inventors:
KATASE TAKUMA
Application Number:
JP2016073746A
Publication Date:
October 12, 2017
Filing Date:
March 31, 2016
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
H01L21/60; C25D5/50; C25D7/00; C25D7/12; C25D15/02
Attorney, Agent or Firm:
Masatake Shiga
Mitsuo Teramoto
Yasushi Matsunuma
Fumihiro Hosokawa
Kazunori Onami
Mitsuo Teramoto
Yasushi Matsunuma
Fumihiro Hosokawa
Kazunori Onami