Title:
SOLDERING DEVICE AND SOLDERING METHOD
Document Type and Number:
Japanese Patent JP2017195222
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To perform soldering on a soldered part even when a thread solder itself twists three dimensionally.SOLUTION: A soldering device comprises: a laser source 1 for irradiating laser 11; a solder supply part 2 for supplying a thread solder 21; a positioning part 41 for positioning an irradiation spot 12 of the laser 11 and a supply point 22 of the thread solder 21 on a soldered part 101 on a substrate 10 so as to isolate the laser 11 applied by the laser source 1 and the thread solder 21 supplied by the solder supply part 2; and a soldering part 42 for performing soldering by making the laser source 1 irradiate the laser 11 on the soldered part 101 and making the solder supply part 2 supply the thread solder 21 to the soldered part 101 after processing by the positioning part 41.SELECTED DRAWING: Figure 1
Inventors:
OSHIMA NOBUKI
Application Number:
JP2016082876A
Publication Date:
October 26, 2017
Filing Date:
April 18, 2016
Export Citation:
Assignee:
AZBIL CORP
International Classes:
H05K3/34; B23K1/00; B23K1/005; B23K3/00; B23K3/06
Attorney, Agent or Firm:
Hideaki Tazawa
Hamada Hatsune
Nakashima Shigeru
Tatsuya Sakamoto
Tsujioka Masaaki
Kazuma Inoue
Hamada Hatsune
Nakashima Shigeru
Tatsuya Sakamoto
Tsujioka Masaaki
Kazuma Inoue