Title:
The soldering method and a soldering device
Document Type and Number:
Japanese Patent JP6067456
Kind Code:
B2
Inventors:
Ichiro Iwai
Yoshitaka Nagano
Yoshitaka Nagano
Application Number:
JP2013071498A
Publication Date:
January 25, 2017
Filing Date:
March 29, 2013
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
B23K1/008; B23K3/00; B23K3/04; B23K31/02
Domestic Patent References:
| JP2121796A | ||||
| JP2002151645A | ||||
| JP57134287A | ||||
| JP8197171A | ||||
| JP3174972A | ||||
| JP2014087840A |
Attorney, Agent or Firm:
Yoshihito Shimizu
Hisayoshi Shimizu
Hisayoshi Shimizu
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