Title:
METHOD AND DEVICE FOR CREATING DATA FOR DISCRETE COMPONENT SOLDERING STATE INSPECTION, AND METHOD AND DEVICE FOR INSPECTING SOLDERING STATE OF DISCRETE COMPONENT USING THE SAME
Document Type and Number:
Japanese Patent JP2017207291
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide: a method and device for creating data for soldering state inspection, capable of markedly reducing the burden of work for setting inspection conditions of a discrete component soldering state, significantly reducing work hours, eliminating the danger of incorrect input and markedly improving inspection efficiency; and a method and device for inspecting the discrete component soldering state.SOLUTION: A method for creating data for soldering state inspection comprises the steps of: acquiring information on the diameter of each land part using gerber data for printed circuit board production; acquiring information on the diameter of a through hole in each land part using drill data for through hole formation; grouping all land parts of the printed circuit board for every pattern combined between the acquired diameter of the land part and the diameter of the through hole to be formed in the land part; and duplicating the inspection conditions of a soldering state inputted and set to one arbitrary representative land part in each group to all land parts except the representative land part when the inspection conditions of the soldering state to the representative land part are inputted and set.SELECTED DRAWING: Figure 2
Inventors:
TSUKAHARA SADAYUKI
Application Number:
JP2016097835A
Publication Date:
November 24, 2017
Filing Date:
May 16, 2016
Export Citation:
Assignee:
MIRTEC JAPAN CO LTD
International Classes:
G01N21/956; G01N21/93; H05K3/34
Attorney, Agent or Firm:
Shinohara International Patent Office
Yasushi Shinohara
Masayuki Fujinaka
Yasushi Shinohara
Masayuki Fujinaka