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Title:
有機半導体層形成用溶液、有機半導体層、および有機薄膜トランジスタ
Document Type and Number:
Japanese Patent JP6733156
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an organic semiconductor solution for forming an organic semiconductor layer which gives high carrier mobility by application.SOLUTION: The organic semiconductor layer forming solution contains an organic solvent and a heteroacene derivative represented by general formula (1) (where substituents Rand Rmay be the same or different and each represent a 3-10C alkyl group, and Tto Tmay be the same or different and each represent an oxygen atom or a sulfur atom). The viscosity of the organic solvent is 2.5 to 10 mPa s inclusive at 25°C.SELECTED DRAWING: None

Inventors:
Saori Ueda
Masato Miyashita
Masato Watanabe
Application Number:
JP2015231803A
Publication Date:
July 29, 2020
Filing Date:
November 27, 2015
Export Citation:
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Assignee:
Tosoh Corporation
International Classes:
H01L51/40; C07D495/22; H01L21/336; H01L29/786; H01L51/05; H01L51/30
Domestic Patent References:
JP2015029019A
JP2014075344A
JP2010265395A
JP2015029020A
JP2013516054A
JP2011515835A
Foreign References:
US20110180787