Title:
音波制御モジュール
Document Type and Number:
Japanese Patent JP7453847
Kind Code:
B2
Abstract:
To stabilize the sensitivity of ultrasonic waves regardless of the external environment of CMUT.SOLUTION: A sonic control module 200 includes an ultrasonic transducer 100 and a pressure adjustment mechanism. The ultrasonic transducer includes an insulating layer 2, a lower electrode 3, an insulating layer 4, an upper electrode 5, a cavity 6, and a through hole 8. The pressure adjustment mechanism includes a container 10 provided outside the ultrasonic transducer 100, and the inside of the container 10 is filled with gas and connected to the cavity 6 via the through hole 8.SELECTED DRAWING: Figure 3
Inventors:
Shuntaro Machida
Hiroki Tanaka
Mitsuhiko Nanri
Keita Tamagawa
Hiroki Tanaka
Mitsuhiko Nanri
Keita Tamagawa
Application Number:
JP2020086433A
Publication Date:
March 21, 2024
Filing Date:
May 18, 2020
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H04R1/44; H04R19/00
Domestic Patent References:
| JP2010278582A | ||||
| JP49045000B1 |
Foreign References:
| WO2009069555A1 |
Attorney, Agent or Firm:
Patent Attorney Tsutsui International Patent Office