Title:
The spacer particle for resin composition layers, and its use
Document Type and Number:
Japanese Patent JP6060188
Kind Code:
B2
Abstract:
Spacer particles for a resin composition layer have a compressive strength at 10% compressive deformation at room temperature of 0.05 to 10 MPa or a compressive strength at room temperature of 0.01 to 2 N determined as a compressive load at 10% compressive deformation when the spacer particles are added into the resin composition layer so that a resin composition layer contains 48% by mass of the spacer particles, have a rate of change in compressive strength at 10% compressive deformation by a temperature change from room temperature to 50°C of 5% or less, a rate of change in compressive strength at 10% compressive deformation by a temperature change from -20°C to room temperature of 30% or less, or a rate of change in compressive strength by a temperature change from -50°C to 50°C of 15% or less determined as a compressive load at 10% compressive deformation, when the spacer particles are added into the resin composition layer so that a resin composition layer contains 48% by mass of the spacer particles, and have a volume average particle diameter of 2 to 200 µm and a coefficient of variation in particle diameter of 15% or less.
Inventors:
Ryosuke Harada
Takahashi Tomoyuki
Fumitaka Ishimori
Takahashi Tomoyuki
Fumitaka Ishimori
Application Number:
JP2015015551A
Publication Date:
January 11, 2017
Filing Date:
January 29, 2015
Export Citation:
Assignee:
Sekisui Plastics Co., Ltd.
International Classes:
C08F220/18; B32B3/10; B32B27/18; C08F2/18
Domestic Patent References:
| JP10073829A | ||||
| JP9222608A | ||||
| JP2001106859A | ||||
| JP2010215764A | ||||
| JP3037201A |
Attorney, Agent or Firm:
Patent Business Corporation Ark Patent Office