Title:
How to divide the package board
Document Type and Number:
Japanese Patent JP6351490
Kind Code:
B2
Abstract:
A package substrate is divided into a plurality of device packages. An adhesive tape is attached to a back side of the substrate by cutting the substrate along a plurality of division lines formed on a front side of the substrate. The substrate includes a device portion partitioned into a plurality of device package regions by the division lines, and a marginal portion surrounding the device portion. A first ultraviolet light is applied to reduce the adhesive force of the adhesive tape in the marginal portion. The adhesive tape is partially peeled from the substrate in the marginal portion, and the substrate is cut along each division line by using a cutting blade to thereby divide the substrate into the device packages. In the dividing step, the marginal portion separated from the substrate is scattered by rotation of the cutting blade and thereby removed from the adhesive tape.
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Inventors:
Kiuchi Hitoto
Kurimura Shigeya
Kurimura Shigeya
Application Number:
JP2014239165A
Publication Date:
July 04, 2018
Filing Date:
November 26, 2014
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301
Domestic Patent References:
| JP2014110271A | ||||
| JP2007048876A | ||||
| JP2012156344A | ||||
| JP2010062375A | ||||
| JP2004281526A | ||||
| JP2000031098A | ||||
| JP50110274A | ||||
| JP2009142992A |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Tomohiro Okamoto
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