Title:
RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3207738
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To expose the other edge of a bonding wire whose one edge is connected to an electrode pad on the surface of a semiconductor chip onto the surface of a resin sealing body and to use the other edge as an external terminal.
SOLUTION: An electrode pad 5 where one edge of a bonding wire 20 made of such metal thin wire as Al and Au is connected to a plurality of electrode pads 5 being formed on the main surface of a semiconductor chip 1 covers such insulation film 15 as SiO2 formed on the main surface of the semiconductor chip 1. The other edge of the bonding wire 20 is exposed to the surface of a resin sealing body 8. An Al lead-out electrode 21 is formed directly above the exposed portion of the bonding wire 20 and a semiconductor chip and an external circuit are electrically connected via the lead-out electrode. Neither a lead frame nor a substrate is used, thus reducing time for forming a semiconductor device and hence reducing cost. Also, the elimination of the lead frame and the substrate reduces the thickness of the package by that amount and hence increases the number of pins.
Inventors:
Naoto Takebe
Application Number:
JP2190096A
Publication Date:
September 10, 2001
Filing Date:
January 15, 1996
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L23/28; H01L21/48; H01L21/56; H01L21/60; H01L21/68; H01L23/12; H01L23/31; (IPC1-7): H01L23/12; H01L21/56
Domestic Patent References:
| JP9134982A | ||||
| JP5299530A |
Attorney, Agent or Firm:
Hisashi Takemura