Title:
構造体の温度膨張抵抗性を改善する構造的装置
Document Type and Number:
Japanese Patent JP5526423
Kind Code:
B2
Abstract:
The structure has a monoblock attachment part (1) glued to a flat rigid panel, where part is molded by hot compression in a composite material e.g. bundles of carbon fibers, pre-impregnated with a heat-set epoxy resin. The part with a shovel (3) has rims intended to retain the glue around recess, where the recess receives a glue. A bar (2) is integrated to the shovel, and has an aluminum insert whose expansion coefficient is greater than an expansion coefficient of the material of the attachment part. The insert is positioned in a mold, during the molding of the attachment part. An independent claim is also included for a method for producing a structural panel assembly structure.
Inventors:
Nicola, Guillo
Jill, Pomato
Olivier, Damiano
Jill, Pomato
Olivier, Damiano
Application Number:
JP2008270803A
Publication Date:
June 18, 2014
Filing Date:
October 21, 2008
Export Citation:
Assignee:
Tales
International Classes:
F16B11/00; B64G1/22; F16B5/00
Domestic Patent References:
| JP2007245880A | ||||
| JP2125500U | ||||
| JP20053070A | ||||
| JP523587B2 | ||||
| JP2005195149A |
Foreign References:
| US3192671 | ||||
| US5324146 |
Attorney, Agent or Firm:
Takahisa Kimura