Title:
中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体
Document Type and Number:
Japanese Patent JP4509550
Kind Code:
B2
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Inventors:
Jun Otsuka
Manabu Sato
Manabu Sato
Application Number:
JP2003432370A
Publication Date:
July 21, 2010
Filing Date:
December 26, 2003
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H01L23/12; H05K1/16; H01L23/32; H05K1/18; H05K3/46
Domestic Patent References:
| JP2003051427A | ||||
| JP2001203125A |
Attorney, Agent or Firm:
Hisahiko Atsumi