Title:
導電性パターン領域を有する構造体及びその製造方法、積層体及びその製造方法、並びに、銅配線
Document Type and Number:
Japanese Patent JP7005625
Kind Code:
B2
Abstract:
Provided is a structure that has highly reliable electroconductive pattern regions, that offers an extremely simple manufacturing process, and that has excellent electrical insulation between the electroconductive pattern regions. This structure (10) having electroconductive pattern regions is provided with a support (11), and, on a surface configured by the support, a layer (14) in which insulation regions (12) containing a copper oxide-and phosphorus-containing organic substance and electroconductive pattern regions (13) containing copper are disposed next to one another. This stack is provided with: a support, a coating layer containing copper oxide and phosphorus and disposed on a surface configured by the support; and a resin layer disposed so as to cover the coating layer.
Inventors:
Masato Saito
Toru Yumoto
Masanori Tsuruta
Toru Yumoto
Masanori Tsuruta
Application Number:
JP2019530558A
Publication Date:
January 21, 2022
Filing Date:
July 18, 2018
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
H05K3/12; H01B5/14; H01B13/00; H05K3/10
Domestic Patent References:
| JP2004253794A | ||||
| JP2004327703A | ||||
| JP1129492A | ||||
| JP2012142318A | ||||
| JP2008193067A | ||||
| JP5041575A |
Foreign References:
| EP3127969A1 |
Attorney, Agent or Firm:
Aoki Atsushi
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma