Title:
A structure material joining method and joining structure
Document Type and Number:
Japanese Patent JP6011734
Kind Code:
B2
Abstract:
A first structural material is bonded to a second structural material with a joining material provided with a mixed layer of a raw-material component for forming an intermetallic compound layer and a resin component that softens and flows during heat treatment interposed therebetween to form bonded structural materials. When the bonded structural materials are heat-treated, the first structural material is joined to the second structural material with an intermetallic compound layer, and the resin component exudes and covers the lateral circumferential (exposed) portion of the intermetallic compound layer with a resin film.
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Inventors:
Satoshi Ishino
Yoshihiro Kawaguchi
Nakano Kosuke
Hidekiyo Takaoka
Yanase Wataru
Yoshihiro Kawaguchi
Nakano Kosuke
Hidekiyo Takaoka
Yanase Wataru
Application Number:
JP2015556801A
Publication Date:
October 19, 2016
Filing Date:
January 06, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B23K20/00
Domestic Patent References:
| JP2008238233A | 2008-10-09 | |||
| JPS63183772A | 1988-07-29 | |||
| JP2013243333A | 2013-12-05 | |||
| JP2006334625A | 2006-12-14 | |||
| JP2011025333A | 2011-02-10 |
Foreign References:
| US20080078554A1 | 2008-04-03 |
Attorney, Agent or Firm:
Kaede International Patent Office