Title:
Structure and film formation method
Document Type and Number:
Japanese Patent JP6361665
Kind Code:
B2
Abstract:
Provided is a structure configured such that even when resin, such as methacryl resin, exhibiting a low adhesion to a metal thin film is used, the resin and the metal thin film are firmly stacked in close contact with each other, and a film formation method capable of manufacturing a structure in which a metal thin film is, with a high adhesion, formed on a resin work exhibiting a low adhesion to the metal thin film, wherein the structure is configured such that an Al thin film 102 is, by sputtering, formed on a work W made of methacryl resin to form a stack of the work W and the Al thin film 102, and has a mixed region 101 of Al, Si, O, and C between the work W and the Al thin film 102. In the mixed region 101, Al is covalently bound to any one of Si, O, and C, or Al, Si, O, and C form a diffusion mixed layer.
Inventors:
Ichioka sacred vegetables
Toshinori Yoshimuta
Satoshi Tokuda
Daisuke Imai
Satoru Ozaki
Tokutake Yu
Toshinori Yoshimuta
Satoshi Tokuda
Daisuke Imai
Satoru Ozaki
Tokutake Yu
Application Number:
JP2015559878A
Publication Date:
July 25, 2018
Filing Date:
January 20, 2015
Export Citation:
Assignee:
SHIMADZU CORPORATION
International Classes:
B32B15/08; C23C14/14; C23C14/20; C23C16/42; C23C16/509
Domestic Patent References:
| JP2011203725A | ||||
| JP2008504994A | ||||
| JP8192492A | ||||
| JP2009107333A | ||||
| JP2013226718A | ||||
| JP2002228815A | ||||
| JP5005801A | ||||
| JP4235502A | ||||
| JP2002248355A | ||||
| JP2010058111A | ||||
| JP8086908A | ||||
| JP2005004892A | ||||
| JP7305166A |
Foreign References:
| WO2008133136A1 |
Attorney, Agent or Firm:
Takashi Otsubo