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Title:
SUBSTRATE ASSEMBLING DEVICE, SUBSTRATE ASSEMBLING SYSTEM USING THE DEVICE, AND SUBSTRATE ASSEMBLING METHOD USING THE SYSTEM
Document Type and Number:
Japanese Patent JP2017080868
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate assembling device efficiently removing gas from a space between an upper substrate and a lower substrate, a substrate assembling system using the device and a substrate assembling method using the system.SOLUTION: The substrate assembling device comprises a vacuum chamber 5 which can store an upper substrate K1 and a lower substrate K2 under a vacuum environment, a vertically moving mechanism (a Z-axis driving mechanism 20) which moves the upper substrate vertically and a vacuum pump mechanism P0 which performs vacuuming for exhausting gas inside the vacuum chamber 5 to the outside. The vertically moving mechanism (the Z-axis driving mechanism 20) changes a separation distance between the upper substrate K1 and the lower substrate K2 by moving the upper substrate K1 in a vertical direction during performing the vacuuming.SELECTED DRAWING: Figure 8I

Inventors:
KAIZU TAKUYA
ICHIMURA HISASHI
NAKAYAMA YUKINORI
ITO MASAAKI
SAITO MASAYUKI
Application Number:
JP2015215005A
Publication Date:
May 18, 2017
Filing Date:
October 30, 2015
Export Citation:
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Assignee:
AIMECHATEC LTD
International Classes:
B23P21/00; G02F1/13; G02F1/1333; G09F9/00
Attorney, Agent or Firm:
Isono International Patent and Trademark Office



 
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