Title:
SUBSTRATE BREAKING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP2017144551
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate breaking device which can effectively break a substrate by heating or cooling in a scribe line direction the substrate formed with a scribe line, and can effectively break the substrate by accurately controlling heating or cooling of the substrate.SOLUTION: A substrate breaking device comprises: a first heat transmitting element for heating or cooling a first region of a substrate formed with a scribe line; and a second heat transmitting element arranged so as to be adjacent to the first heat transmitting element in the scribe line direction for cooling or heating a second region of the substrate reversely to the first region.SELECTED DRAWING: Figure 1
Inventors:
SEO YONG SIK
Application Number:
JP2017064684A
Publication Date:
August 24, 2017
Filing Date:
March 29, 2017
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD
International Classes:
B26F3/08; B28D5/00; C03B33/033
Domestic Patent References:
| JP2002047024A | 2002-02-12 | |||
| JP2007099587A | 2007-04-19 | |||
| JP2001222955A | 2001-08-17 | |||
| JP2001151525A | 2001-06-05 |
Foreign References:
| US20020006765A1 | 2002-01-17 | |||
| WO2004067243A1 | 2004-08-12 |