Title:
基板乾燥装置及び基板処理方法
Document Type and Number:
Japanese Patent JP4642639
Kind Code:
B2
Abstract:
A substrate drying device according to an embodiment of the present invention includes: a nozzle ejecting a fluid to a substrate to be processed, wherein the substrate is moved relative to the nozzle while the nozzle is spraying the fluid to dry the substrate, a parallel component to a surface of the substrate in an ejection direction of the fluid is inclined with respect to a moving direction in which the substrate moves relative to the nozzle, and an angle between the parallel component and the moving direction is changed at a changed portion in a predetermined position of the nozzle.
More Like This:
| WO/2001/099156 | CONFIGURABLE SINGLE SUBSTRATE WET-DRY INTEGRATED CLUSTER CLEANER |
| WO/2001/056713 | DEVICE AND METHOD FOR WASHING SUBSTRATE END FACE |
| JP2023036955 | DEVICE AND METHOD FOR REMOVING PERIPHERAL EDGE |
Inventors:
Nishiura Atsunori
Application Number:
JP2005330062A
Publication Date:
March 02, 2011
Filing Date:
November 15, 2005
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/304; F26B9/06; F26B15/10; F26B21/14; H01L21/027
Domestic Patent References:
| JP9159360A | ||||
| JP10275792A | ||||
| JP10180205A |
Attorney, Agent or Firm:
Ken Ieiri