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Patent Searching and Data


Title:
基板加熱装置、基板加熱方法及び赤外線ヒータ
Document Type and Number:
Japanese Patent JP6757629
Kind Code:
B2
Abstract:
Balance of a temperature distribution of an infrared heater is improved. According to an embodiment, a substrate heating device comprises: a pressure reducing unit for reducing pressure of the atmosphere of an accommodating space of a substrate onto which a solution is applied; and an infrared heater capable of heating the substrate by an infrared ray. The infrared heater comprises: a bending unit bent to form tubular shapes at multiple points and be outwardly convex; and a cover unit disposed to cover at least a portion of the bending unit from the outside.

Inventors:
Shigeru Kato
Tsutomu Sabota
Kenichi Yamatani
Yoshiaki Masu
Application Number:
JP2016167793A
Publication Date:
September 23, 2020
Filing Date:
August 30, 2016
Export Citation:
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Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
H05B3/66; F27B17/00; F27D11/02; H05B3/64
Domestic Patent References:
JP2005019479A
JP3060663U
JP2005011852A
JP2015141965A
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida