Title:
BASE MATERIAL PARTICLE, CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2018101630
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a base material particle which can reduce connection resistance and inhibit connection failure caused by springback in electrodes when the electrodes are electrically connected using conductive particles having a conductive layer formed on the surface.SOLUTION: A base material particle 11 allows a conductive layer 2 to be formed on the surface and is used to obtain a conductive particle 1 having the conductive layer 2. The compression recovery rate of the base material particle 11 is less than 50%. The compressive modulus when the base material particle 11 is compressed by 10% is at least 6000 N/mmand less than 10000 N/mm. The ratio of the load when the base material particle 1 is compressed by 30% to the load when compressed by 10% is 3 or less.SELECTED DRAWING: Figure 1
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Inventors:
NAGAI YASUHIKO
UENOYAMA SHINYA
O GYOKA
YAMADA YASUYUKI
UENOYAMA SHINYA
O GYOKA
YAMADA YASUYUKI
Application Number:
JP2018008286A
Publication Date:
June 28, 2018
Filing Date:
January 22, 2018
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01B5/00; C08F12/36; C08J3/12; C08K3/00; C08L101/00; C09J9/02; C09J11/04; C09J11/08; C09J201/00; H01B1/00; H01B1/22; H01B5/16; H01R11/01
Domestic Patent References:
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Foreign References:
| WO2012020799A1 | 2012-02-16 | |||
| US6344156B1 | 2002-02-05 | |||
| US20070160840A1 | 2007-07-12 |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office