Title:
基板処理装置及び基板処理方法
Document Type and Number:
Japanese Patent JP6425810
Kind Code:
B2
Abstract:
A substrate treatment device includes: a substrate holding unit including a plate-shaped holding table that rotatably holds a substrate so that a surface of the substrate on which the fine patterns are formed faces downward, and a plurality of holding pins provided on the holding table to hold an outer periphery of the substrate at a plurality of points; a heater that heats the substrate; a cover that internally houses the substrate holding unit and the heater, and forms a treatment chamber; a pump that exhausts the treatment chamber to make a negative-pressure atmosphere; an inert gas supply port that faces an opposite side surface opposite to the surface with the fine patterns formed thereon, and supplies inert gas into the treatment chamber; and a nozzle to jet a cleaning solution toward the surface with the fine patterns formed thereon and a gas exhaust port to communicate with the pump.
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| JP2003188125 | POLISHING APPARATUS |
| JP2022098711 | POLISHING COMPOSITION |
Inventors:
Kazuo Sugihara
Application Number:
JP2017523651A
Publication Date:
November 21, 2018
Filing Date:
June 07, 2016
Export Citation:
Assignee:
JET Co., Ltd.
International Classes:
H01L21/304; B08B3/02; F26B5/04; F26B9/06; F26B21/00
Domestic Patent References:
| JP2012156266A | ||||
| JP201592530A | ||||
| JP2007273806A |
Attorney, Agent or Firm:
Masayoshi Yoshida
Hiromitsu Imaeda
Umemura Hiroaki
Kohei Horikiri
Yasuko Yoshida
Hiromitsu Imaeda
Umemura Hiroaki
Kohei Horikiri
Yasuko Yoshida