Title:
A substrate with built-in parts, and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6166265
Kind Code:
B2
Abstract:
The present invention provides a component-embedded substrate (1) formed by dividing a laminate which is formed by bonding a component (12) onto a conductive material (10) placed on a support (8); sequentially laminating an insulation material (18, 28) and a core substrate (20) each having a component avoiding hole (32) which avoids the component; and hot-pressing the laminate to allow the melted insulation material to flow into the component avoiding hole to thereby form an integrated laminate (2, 36), wherein the component-embedded substrate includes regulation means (16, 34, 32, 38) which limits the displacement of the core substrate slipping on the insulation material melted during the hot pressing.
Inventors:
Toru Matsumoto
Kentaro Aoki
Mitsuaki Toda
Kentaro Aoki
Mitsuaki Toda
Application Number:
JP2014534139A
Publication Date:
July 19, 2017
Filing Date:
September 10, 2012
Export Citation:
Assignee:
Meiko Co., Ltd.
International Classes:
H05K3/46; H01L23/12; H05K3/00
Domestic Patent References:
| JP2010157664A | ||||
| JP2008192999A | ||||
| JP2009099731A | ||||
| JP2007189202A |
Attorney, Agent or Firm:
Koji Nagato