Title:
基板
Document Type and Number:
Japanese Patent JP5352647
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic apparatus having metallized wiring which is excellent in conductivity, electrochemical stability, oxidation resistance, filling properties, compactness, and mechanical and physical strength, which achieves high bonding force and adhesive force to a substrate and high quality and high reliability.SOLUTION: A substrate 11 has metallized wiring 12 having a predetermined pattern. The metallized wiring 12 includes a metallized layer 121 and an insulation layer 122. The metallized layer 121 includes a high melting point metal component and a low melting point metal component, and the high melting point metal component and the low melting point metal component are diffusely joined to each other. The insulation layer 122 is formed concurrently with the metallized layer 121 and covers an outer surface of the metallized layer 121. An electronic component 14 electrically connects with the metallized layer 121 of the metallized wiring 12.
Inventors:
Shigenobu Sekine
Yuri Sekine
Yuri Sekine
Application Number:
JP2011186353A
Publication Date:
November 27, 2013
Filing Date:
August 29, 2011
Export Citation:
Assignee:
Napura Co., Ltd.
International Classes:
H05K1/09; G02F1/13357; H01L31/04; H01L31/042; H01L33/48; H05K3/28; H05K3/34
Domestic Patent References:
| JP2006165508A | ||||
| JP2003104772A |
Attorney, Agent or Firm:
Mijiro Abe