Title:
基板
Document Type and Number:
Japanese Patent JP7375987
Kind Code:
B2
Abstract:
A substrate that includes a film-shaped member that has a first main surface and a second main surface; a first electrode that has a third main surface and a fourth main surface, the third main surface facing the second main surface of the film-shaped member, the first electrode having a first patterning region with a first part where the film-shaped member is exposed from the first electrode and a second part where the film-shaped member is not exposed from the first electrode; and an adhesive tape facing the fourth main surface of the first electrode and the second main surface of the film-shaped member such that the adhesive tape is disposed across the first part and the second part in the first patterning region.
Inventors:
Takashi Inoue
Shozo Ohtera
Yutaka Ishiura
Jun Endo
Yoshihiko Nishizawa
Shozo Ohtera
Yutaka Ishiura
Jun Endo
Yoshihiko Nishizawa
Application Number:
JP2023529581A
Publication Date:
November 08, 2023
Filing Date:
March 23, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H10N30/87; H10N30/06; H10N30/20; H10N30/857; H10N30/88
Domestic Patent References:
| JP2011009709A | ||||
| JP2011244109A | ||||
| JP2020165887A | ||||
| JP2014072339A | ||||
| JP2012174578A | ||||
| JP2005278069A | ||||
| JP2021030648A |
Attorney, Agent or Firm:
Patent Attorney Kaede International Patent Office