Title:
SURFACE MOUNTED SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0621177
Kind Code:
A
Abstract:
PURPOSE: To provide a semiconductor device, in which the temperature at a semiconductor chip mounted on an island and sealed with a resin can be measured accurately and stably.
CONSTITUTION: A semiconductor pellet is mounted on an island 11. A p-n junction provided between a p-type semiconductor 4 and an n-type semiconductor 5 is formed on the rear face of the island 11. These semiconductors 4 and 5 are connected to an outer lead 12a. While a voltage is supplied through the outer lead 12a to the P-n junction, the temperature at the pn-junction or around the pn-junction, namely the temperature at the semiconductor pellet, can be measured from its voltage, current, and so on.
Inventors:
YANAGIYA MASANOBU
MASAGO HAYAMI
MASAGO HAYAMI
Application Number:
JP19598692A
Publication Date:
January 28, 1994
Filing Date:
June 30, 1992
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/66; H01R4/02; (IPC1-7): H01L21/66
Attorney, Agent or Firm:
Suzuki Akio
Next Patent: フラットケーブル用コネクタ