Title:
A surface property measuring apparatus of a polishing pad
Document Type and Number:
Japanese Patent JP6066192
Kind Code:
B2
Abstract:
The present invention relates to an apparatus for measuring surface properties of a polishing pad which measures surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The apparatus for measuring surface properties of a polishing pad includes a laser beam source configured to emit a laser beam, and a photodetector configured to detect scattered light that is reflected and scattered by the polishing pad, an optical Fourier transform being performed on the detected scattered light to produce an intensity distribution corresponding to a spatial wavelength spectrum based on surface topography of the polishing pad. The laser beam is applied to the polishing pad at such an incident angle that the laser beam does not reach a bottom portion of a pore formed in the surface of the polishing pad.
Inventors:
Naonori Matsuo
Kimura Keiichi
Megumi Suzuki
Kacheon Lung Luang Panath
Takashi Kushida
Kimura Keiichi
Megumi Suzuki
Kacheon Lung Luang Panath
Takashi Kushida
Application Number:
JP2013049685A
Publication Date:
January 25, 2017
Filing Date:
March 12, 2013
Export Citation:
Assignee:
Ebara Corporation
Kyushu Institute of Technology
Kyushu Institute of Technology
International Classes:
B24B37/20; B24B49/12; B24B49/18; B24B53/017; G01B11/30; H01L21/304
Domestic Patent References:
| JP2012137484A | ||||
| JP9285955A | ||||
| JP2008002891A | ||||
| JP2010023210A |
Foreign References:
| US20040110449 |
Attorney, Agent or Firm:
Isamu Watanabe
Tetsuya Hirosawa
Tetsuya Hirosawa