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Title:
シラップ組成物、その硬化物および被覆方法
Document Type and Number:
Japanese Patent JP5134947
Kind Code:
B2
Abstract:

To provide a syrup composition having low viscosity to allow easy coating work, producing a cured material with high strength, and exhibiting excellent durability under high temperature conditions.

The syrup composition contains 100 pts.mass of syrup (X) and 0.1-5 pts.mass of a wax (C). The syrup (X) comprises 60-80 mass% of an acrylic monomer (A) and 20-40 mass% of a polymer (B) having a butyl methacrylate unit or an isobornyl (meth)acrylate unit and having a double bond.

COPYRIGHT: (C)2009,JPO&INPIT


Inventors:
Satoshi Aoki
Mikio Takasu
Kazuyoshi Shima
Yujiro Yoshii
Application Number:
JP2007339746A
Publication Date:
January 30, 2013
Filing Date:
December 28, 2007
Export Citation:
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Assignee:
Mitsubishi Rayon Co., Ltd.
International Classes:
C08F290/12; C09D5/02; C09D5/33; C09D133/00; C09D191/06
Domestic Patent References:
JP10245422A
JP7162116A
JP2002020440A
JP2001002957A
JP2007010885A
JP2002114830A
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama



 
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