Title:
A system and a method for the heat management in the portable computing device which uses heat resistance in order to predict the optimal electric power level
Document Type and Number:
Japanese Patent JP6162262
Kind Code:
B2
Abstract:
Various embodiments of methods and systems for thermal energy management in a portable computing device (“PCD”) based on power level calculations are disclosed. An exemplary method includes tracking instantaneous operating temperatures and active power supply levels to one or more components. With an estimate or measurement of ambient temperature, the instantaneous operating temperature values and active power supply level values can be used to calculate an instantaneous thermal resistance value. In the event that thermal energy generation should be managed, a target operating temperature may be used with the ambient temperature and the instantaneous thermal resistance value to solve for an optimum power supply level. The active power supply level may then be adjusted based on the calculated optimum power supply level.
Inventors:
Yunni Krishnan Vadakkan Marvidou
Pallas S. Dosi
Ancourt Jine
Vinay Mitter
Richard A Stewart
Pallas S. Dosi
Ancourt Jine
Vinay Mitter
Richard A Stewart
Application Number:
JP2015559308A
Publication Date:
July 12, 2017
Filing Date:
February 26, 2014
Export Citation:
Assignee:
Qualcomm, Inc.
International Classes:
G06F1/20; G06F1/04; G06F1/32
Domestic Patent References:
| JP2009042211A | ||||
| JP2004310785A | ||||
| JP2012221301A |
Foreign References:
| WO2012094558A1 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Kuroda Shinpei
Kuroda Shinpei