Title:
The tape for semiconductor processing
Document Type and Number:
Japanese Patent JP6230730
Kind Code:
B2
Abstract:
[Problem] To provide a semiconductor processing tape which has a low thermal shrinkage rate and is not subject to wrinkles because the tape shrinks uniformly regardless of tape direction, and in which kerf width extends uniformly without displacement of chip position. [Solution] Provided is a semiconductor processing tape that is characterized in that the thermal shrinkage rate in both the length direction and width direction of the tape when heated for 10 seconds at 100 °C is 0-20%, inclusive, and when the thermal shrinkage rate in either the length direction or the width direction is 0.1% or more, the thermal shrinkage rate in the length direction/the thermal shrinkage rate in the width direction = 0.01-100, inclusive. (Shrinkage rate = (dimensions before heating - dimensions after heating)/dimensions before heating ×100(%))
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Inventors:
Toru Sano
Jiro Sugiyama
Masami Aoyama
Jiro Sugiyama
Masami Aoyama
Application Number:
JP2016570125A
Publication Date:
November 15, 2017
Filing Date:
March 24, 2016
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01L21/301; B23K26/53; C09J7/20
Domestic Patent References:
| JP2011216508A |
Foreign References:
| WO2004090962A1 |
Attorney, Agent or Firm:
Seiichi Inoue
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