Title:
温度センサアレイ並びにその製造及び使用方法
Document Type and Number:
Japanese Patent JP4795507
Kind Code:
B2
Abstract:
A thermal sensor array includes a dielectric layer including a plurality of individual thermal sensors and a pattern of deposited electrical interconnections facing at least one surface of the dielectric layer for providing electrical connections from each of the plurality of individual thermal sensors, the dielectric layer and the pattern of deposited electrical interconnections being surface-conformable. The thermal sensor array can be used in a diagnostic tool that further includes: a scanning device coupled to the pattern of deposited electrical interconnections for obtaining sensor signals from the thermal sensors; and a computer for processing the sensor signals to estimate temperature distributions.
Inventors:
Christina Helena Balborg Heden Glen
William Paul Cornrumuf
Mark Lloyd Miller
Biele Hibbs Opsal-Ong
Eguidillas Edward Uzgiris
William Paul Cornrumuf
Mark Lloyd Miller
Biele Hibbs Opsal-Ong
Eguidillas Edward Uzgiris
Application Number:
JP2000110458A
Publication Date:
October 19, 2011
Filing Date:
April 12, 2000
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
A61B5/01; G01K1/14; G01K3/14; G01K7/02; H01L35/20; H01L35/32
Domestic Patent References:
| JP63193023A | ||||
| JP2263483A | ||||
| JP10505252A | ||||
| JP7146186A |
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Hirokazu Ogura
Toshihisa Kurokawa