Thermal conductive sheet with release sheet

Japanese Patent JP6368507

B2

PROBLEM TO BE SOLVED: To provide a thermally conductive sheet with a release sheet, in which the release sheet can be easily released from the thermally conductive sheet.SOLUTION: There is provided a thermally conductive sheet with a release sheet, including a thermally conductive sheet and a release sheet laminated on the thermally conductive sheet. The thermally conductive sheet with a release sheet is used for forming a semiconductor module including a module body, a heat dissipation member, and the thermally conductive sheet interposed between the module body and the heat dissipation member. The thermally conductive sheet includes an insulation layer containing inorganic fillers and a thermosetting resin. The release sheet has a release sheet body having an outer peripheral edge whose shape is substantially same with the shape of an outer peripheral edge of the thermally conductive sheet, is laminated on the thermally conductive sheet such that the outer peripheral edge of the release sheet body coincides with the outer peripheral edge of the thermally conductive sheet, and further has an extension part extending from the outer peripheral edge of the release sheet body to the outside.

Akihiro Ohashi
Chiune Ishiune
Hiroyuki Makita

JP2014051165A

August 01, 2018

March 14, 2014

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Nitto Shinko Co., Ltd.

H01L23/36

JP2013138087A
JP2012151222A
JP2011238643A
JP7149365A
JP2013089843A
JP2009130251A

WO2008126711A1

Noboru Fujimoto
Hiroaki Nakatani

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