Title:
熱管理装置
Document Type and Number:
Japanese Patent JP7434744
Kind Code:
B2
Abstract:
This heat management apparatus comprises: a first heat dissipation unit (12) that dissipates heat from the refrigerant discharged from a compressor; a second heat dissipation unit (16A) that dissipates heat from the refrigerant discharged from the first heat dissipation unit into an air flow; an evaporator (20) that evaporates the refrigerant; a chiller (24) that evaporates the refrigerant by causing the refrigerant to absorb heat from a heat medium; a bypass refrigerant passage (18) that allows the refrigerant discharged from the first heat dissipation unit to flow through the evaporator and chiller, bypassing the second heat dissipation unit; a switching valve (14) that sets the bypass refrigerant passage to a first state in which the bypass refrigerant passage is closed or a second state in which the bypass refrigerant passage is open; a radiator (16B) that performs heat exchange between the heat medium and the air flow; and a heat medium circuit (53) that circulates the heat medium between the chiller and the radiator. In a first mode in the first state, the refrigerant in the second heat dissipation unit dissipates heat into the air flow through the radiator. In a second mode in which the heat medium in the heat medium circuit is circulating in the second state, the heat medium in the radiator absorbs heat from the air flow through the second heat dissipation unit.
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Inventors:
Hiroshi Saegusa
Atsushi Inaba
Kazuhiro Tada
Atsushi Inaba
Kazuhiro Tada
Application Number:
JP2019136355A
Publication Date:
February 21, 2024
Filing Date:
July 24, 2019
Export Citation:
Assignee:
株式会社デンソー
International Classes:
B60H1/22; B60H1/32; F25B1/00; F25B39/04; F25B43/00
Attorney, Agent or Firm:
Patent Attorney Corporation Yuuai Patent Office