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Title:
THERMAL PRINT HEAD AND THERMAL PRINTER
Document Type and Number:
Japanese Patent JP2017170618
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To achieve down-sizing of a thermal print head.SOLUTION: A thermal printer 1 comprises: a heat radiating plate 30; a circuit board 40 located on a top face of the heat radiating plate 30; a heating element plate 20 which is located on the top face of the heat radiating plate 30; and a platen roller which presses a medium to be printed onto the heating element plate 20. In the heating element plate, a circuit board separation side rising angle Θ2, which is a rising angle of an inclined plane of a ridge 56, on which a heating resistor 23a is located, on a side separating from the circuit board 40, is so made as to be larger than a circuit board adjacent side rising angle Θ1 which is a rising angle of the inclined plane on a side adjacent to the circuit board 40.SELECTED DRAWING: Figure 3

Inventors:
TAJI MAMI
AZUMA ATSUSHI
Application Number:
JP2016055573A
Publication Date:
September 28, 2017
Filing Date:
March 18, 2016
Export Citation:
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Assignee:
TOSHIBA HOKUTO ELECTRONICS CORP
International Classes:
B41J2/335
Domestic Patent References:
JPH0761016A1995-03-07
JPS60182149U1985-12-03
JP2014069374A2014-04-21
JPH07329331A1995-12-19
JPH0224945U1990-02-19
JPH01304959A1989-12-08
JPS62164556A1987-07-21
JPS6221559A1987-01-29
JP2012056279A2012-03-22
JP2008132635A2008-06-12
Foreign References:
US6133929A2000-10-17
Attorney, Agent or Firm:
Keiki Tanabe
Koichi Okuda
Norio Ohu