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Title:
熱調節システム
Document Type and Number:
Japanese Patent JP7448908
Kind Code:
B2
Abstract:
A sorption heat pump having an evaporator containing a working fluid to evaporate the fluid to produce a gas, a sorber containing a sorption material to sorb the gas during a sorption phase, a vapor pathway connecting the evaporator and sorber, and a thermal control unit controlling the rate of vapor flow between the evaporator and sorber through the pathway, and being selectively operable to permit, stop and restart the flow of gas through the pathway. The pump may be used with a compartment storing temperature sensitive material. The evaporator may be positioned inside and the sorber outside the compartment, or the sorber may be positioned inside and the evaporator outside the compartment. The pump may be used in an apparatus including both cool and warm compartments, with an insulation layer in each. A method is disclosed for reusing the pump after the sorption material has been sorbed.

Inventors:
Fowler, Lawrence Morgan
Ellington, Victoria E. H.
Myr-Lux Hoover, Peter
Paul Schuk, Ivan
Words, Rainer
Schmidt, Ralph
Application Number:
JP2021568744A
Publication Date:
March 13, 2024
Filing Date:
May 29, 2020
Export Citation:
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Assignee:
Gobi Technologies Incorporated
International Classes:
F25B17/08; F25B30/04
Domestic Patent References:
JP2018531357A
JP2008215808A
JP2009002642A
JP2016514824A
JP2016516973A
JP2004233039A
Foreign References:
US20190170418
US20060191287
Attorney, Agent or Firm:
Patent Attorney Corporation RYUKA International Patent Office