Title:
熱伝導性組成物および熱伝導性部材
Document Type and Number:
Japanese Patent JP6561410
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermal conductive composition good in storage stability, capable of being cured quickly by heating, having flexibility and good surface hardness.SOLUTION: There is provided a thermal conducive composition containing a liquid polymer, an organic peroxide and a thermal conducive filler, where the liquid polymer contains polyfunctional (meth)acryloyl modified silicone of 10 to 25 mass% and amino modified silicone of 10 to 90 mass% and the 1 hour half-life temperature of the organic peroxide is 100°C.SELECTED DRAWING: None
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Inventors:
Manabu Kitada
Application Number:
JP2015092804A
Publication Date:
August 21, 2019
Filing Date:
April 30, 2015
Export Citation:
Assignee:
Sekisui Polymatec Co., Ltd.
International Classes:
C08L83/08; C08F299/08; C08K3/00; C08K5/14; C08L83/07; C09K5/14
Domestic Patent References:
| JP4164964A | ||||
| JP1210461A | ||||
| JP63128075A |
Attorney, Agent or Firm:
Shogo Otake